The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2009
Filed:
Feb. 15, 2005
Takashi Funato, Tokyo, JP;
Takatoshi Nishizawa, Ibaraki, JP;
Masaki Shiina, Ibaraki, JP;
Yupo Corporation, Tokyo, JP;
Abstract
An in-mold label includes a thermoplastic resin film substrate layer and a heat-seal resin layer. The label has a label body and a separable part. Tearable perforations are provided between the label body and the separable part. The adhesion strength between the separable part and a thermoplastic resin container is from 80 to 270 gf/10 mm, when the label is stuck to the container during in-mold production of the container. A lubricant is applied to from 55 to 80% of the surface area of the heat-seal resin layer of the separable part. The wettability index of both the thermoplastic resin film substrate layer surface and the heat-seal resin layer surface is from 34 to 73 mN/m.