The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2004

Filed:

Jul. 24, 2001
Applicant:
Inventors:

Takatoshi Nishizawa, Ibaraki, JP;

Masaki Shiina, Ibaraki, JP;

Assignee:

Yupo Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 ; G09F 3/04 ;
U.S. Cl.
CPC ...
B32B 7/12 ; G09F 3/04 ;
Abstract

A label for in-mold decorating, which comprises (I) a thermoplastic resin film base layer, (II) an interlayer overlying said base layer and comprising (a) a thermoplastic resin composition, and (b) at least one antistatic agent, and (III) a heat-sealable resin layer overlying said interlayer. The label for in-mold decorating can be manufactured without developing a resin-like stain or causing roll contamination. It is free from inconveniences arising from insufficient antistatic properties in printing, cutting, blanking, and inserting into a mold, irrespective of the working environment. In addition, it exhibits a high adhesive strength upon application to a molded container.


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