The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2003
Filed:
Apr. 16, 2001
Takatoshi Nishizawa, Kashima-gun, JP;
Masaki Shiina, Kashima-gun, JP;
Hironobu Taniguchi, Kashima-gun, JP;
Yupo Corporation, Tokyo, JP;
Abstract
An in-mold decorating label, which comprises a thermoplastic resin film substrate layer (I) having provided on its backside a heat-sealable resin layer (II), the heat-sealable resin layer (II) containing a polyethylenic resin and at least one of (i) a fatty acid amide having a molecular weight of 300 or more and (ii) an organic or inorganic fine powder having an average particle size larger than thickness of the heat-sealable resin layer (II). This label for use in in-mold decorating has excellent feeding and discharging properties upon printing and workability during sheeting, which facilitates insertion of the label into a metal mold during in-mold decorating, and provides a label-laminated container which does not suffer from blister generation and has a large welding force between the container and the label.