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For the Inventor, By the Inventor

Offenbach, Germany

Martin Schlott

This inventor holds 15 USPTO granted patents and 8 published patent applications and 13 EPO patents, primarily in Sputtering Targets. Top assignees: Leybold Materials Gmbh, Materion Advanced Materials Germany Gmbh, Heraeus Deutschland Gmbh & Co Kg. Active years: 1996-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Martin Schlott. Retrieved from https://idiyas.com/inventor/martin-schlott

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 15 

% Patents Active = 66.7

 

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 28(Granted Patents)


Location History:

  • Hanau, DE (1996 - 1998)
  • Hanau am Main, DE (2001 - 2002)
  • Offenbach, DE (2013 - 2023)

Company Filing History:

goldMedal5 out of 6 
 
Leybold Materials Gmbh
 patents
silverMedal5 out of 7 
 
Materion Advanced Materials Germany Gmbh
 patents
bronzeMedal3 out of 201 
 
Heraeus Deutschland Gmbh & Co Kg
 patents
4. 1 out of 12 
 
Heraeus Materials Technology Gmbh & Co. Kg
 patents
5. 1 out of 1 
 
Leybold Material Gmbh
 patent

Years Active: 1996-2026

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Areas of Expertise:
Sputtering Target
Magnetic Properties
Thin Film Transistor
Copper Electrodes
Cobalt Base Alloy
Indium Oxide
Tin Oxide
Cathodic Sputtering
Performance Optimization
Recycling Process
Amorphous Portions
Microcrystalline Portions
15 patents (USPTO):Explore Patents
1. 12662730 - CoZrTa(X) sputtering target with improved magnetic properties (2026-06-23),
2. 11566320 - NiW(X) sputtering target with improved structure (2023-01-31),
3. 11125708 - Silver alloy-based sputter target (2021-09-21),
4. 10487392 - Double-layer system comprising a partially absorbing layer, and method and sputter target for producing said layer (2019-11-26),
5. 9960022 - Sputtering target with optimized performance characteristics (2018-05-01),
6. 9334564 - Tube-shaped sputtering target (2016-05-10),
7. 9051646 - Sputtering target having amorphous and microcrystalline portions and method of producing same (2015-06-09),
8. 8974707 - Planar or tubular sputtering target and method for the production thereof (2015-03-10),
9. 8581248 - Thin film transistor (TFT) having copper electrodes (2013-11-12),
10. 6372104 - Cobalt base alloy sputtering target with high magnetic field penetration (2002-04-16),
11. 6187253 - Method of preparing indium oxide/tin oxide target for cathodic sputtering (2001-02-13),
12. 5728279 - Cobalt base alloy target for a magnetron cathode sputtering system (1998-03-17),
13. 5660599 - Process for the recycling of spent indium oxide-tin oxide sputtering (1997-08-26),
14. 5531948 - Process for the production of partially reduced indium oxide-tin oxide (1996-07-02),
15. 5480532 - Sputter target for cathodic atomization to produce transparent, (1996-01-02),

Title: The Innovative Journey of Martin Schlott: A Trailblazer in Sputtering Technologies

Introduction: Martin Schlott, an accomplished inventor based in Offenbach, Germany, has made significant contributions to the field of materials science, particularly in the development of advanced sputtering targets. With a remarkable portfolio of 14 patents, his work continues to push the boundaries of innovation in various industrial applications.

Latest Patents: Among his latest inventions, Schlott has developed a NiW(X) sputtering target with an improved structure. This invention focuses on a target composition that includes Nickel (Ni), Tungsten (W), and optionally, other metals selected from refractory metals, Tin (Sn), Aluminum (Al), and Silicon (Si). The enhanced design results in a normalized peak intensity ratio that optimizes performance in sputtering processes. Another notable patent is centered around a silver alloy-based sputter target, which incorporates a unique silver alloy component, further expanding the applications of materials in this technology.

Career Highlights: Martin Schlott has worked with renowned companies in the industry, including Leybold Materials GmbH and Materion Advanced Materials Germany GmbH. His expertise and innovative spirit have driven advancements in material applications, particularly in sputtering technologies used in electronics and other high-tech industries.

Collaborations: Throughout his career, Schlott has collaborated with several notable professionals, including Martin Kutzner and Bruce Gehman. These partnerships have fostered an environment of creativity and shared knowledge, contributing to his success in developing cutting-edge solutions in materials science.

Conclusion: Martin Schlott's journey as an inventor underscores the importance of innovation in advancing technology and materials processing. His extensive patent portfolio and collaborative efforts highlight his significant role in shaping the future of sputtering technologies, ensuring that his contributions will have a lasting impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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