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For the Inventor, By the Inventor

Munich, Germany

Markus Rauscher

USPTO Granted Patents = 83 

 

Average Co-Inventor Count = 22.8

ph-index = 8

Forward Citations = 254(Granted Patents)

Forward Citations (Not Self Cited) = 202(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal82 out of 203 
 
Pdf Solutions, Incorporated
 patents
silverMedal1 out of 4 
 
Blickfeld Gmbh
 patents

Years Active: 2017-2022

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Areas of Expertise:
Light Detection And Ranging
Integrated Circuits
Non-Contact Electrical Measurements
Semiconductor Wafer Processing
NCEM-Enabled Fill Cells
Charged Particle-Beam Inspection
Test Structures
Electrical Short Detection
Semiconductor Manufacturing
Die And Chip Fabrication
Standard Cell Compatible Designs
E-Beam Pads
83 patents (USPTO):Explore Patents
1. 11531089 - Coaxial setup for light detection and ranging, lidar, measurements (2022-12-20),
2. 11107804 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-31),
3. 11081477 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),
4. 11081476 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),
5. 11075194 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-07-27),
6. 11018126 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-05-25),
7. 10978438 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-04-13),
8. 10854522 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas (2020-12-01),
9. 10777472 - IC with test structures embedded within a contiguous standard cell area (2020-09-15),
10. 10593604 - Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells (2020-03-17),
11. 10290552 - Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-05-14),
12. 10269786 - Integrated circuit containing first and second DOEs of standard Cell Compatible, NCEM-enabled Fill Cells, with the first DOE including tip-to-side short configured fill cells, and the second DOE including corner short configured fill cells (2019-04-23),
13. 10211112 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas (2019-02-19),
14. 10211111 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side sort, and corner short test areas (2019-02-19),
15. 10199294 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of a least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-02-05),

Title: Innovations and Patents of Markus Rauscher

Introduction

Markus Rauscher, an innovative inventor based in Munich, Germany, has made significant contributions to the field of technology with a remarkable portfolio of 83 patents. His inventions primarily focus on light detection and ranging (LIDAR) systems and integrated circuits (ICs), showcasing his expertise in advanced manufacturing processes and measurement technology.

Latest Patents

Among his latest patents is a groundbreaking LIDAR system designed for ranging objects using both primary and secondary light reflections. This system incorporates a laser that emits primary light directed towards a scanning element, with a specialized arrangement of the receive beam to enhance detection accuracy. Another notable patent involves an integrated circuit that features test structures and e-beam pads embedded within a contiguous standard cell area, which supports advanced manufacturing processes and enables efficient testing.

Career Highlights

Markus has worked with reputable companies such as Pdf Solutions, Inc. and Blickfeld GmbH, where he applied his innovative thinking and technical skills to develop state-of-the-art technologies. His career is marked by a dedication to pushing the boundaries of what is possible in measurement systems and integrated circuits.

Collaborations

Throughout his career, Markus has collaborated with industry professionals, including notable coworkers Stephen Lam and Dennis Ciplickas. These partnerships have fostered an environment of shared ideas and advancements, contributing to his impressive number of patents and innovations.

Conclusion

Markus Rauscher's commitment to innovation in LIDAR systems and integrated circuit technology sets him apart as a leading inventor in his field. With a strong foundation in collaborative efforts and a proven track record of groundbreaking patents, Markus continues to shape the future of technology through his inventive spirit.

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