Taipei, Taiwan

Kuo-Hwa Tzeng

This inventor holds 22 USPTO granted patents and 1 published patent application, primarily in Semiconductor Manufacturing. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2010-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuo-Hwa Tzeng. Retrieved from https://idiyas.com/inventor/kuo-hwa-tzeng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 81.8

Average Co-Inventor Count = 4.3

ph-index = 5

Forward Citations = 121(Granted Patents)


Location History:

  • Hsinchu, TW (2021)
  • Taipei, TW (2010 - 2024)

Company Filing History:


Years Active: 2010-2025

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Areas of Expertise:
Wafer Bonding
Trench Isolation
Semiconductor Device
SOI Substrate
Carrier-Trapping Layers
Interconnect Structures
High Dielectric Constant
Dark Current Improvement
Selective Etch-Back
STI Formation
Hybrid Gap-Fill
Shallow Trench Isolation
22 patents (USPTO):Explore Patents

Title: An Insight into the Innovations of Kuo-Hwa Tzeng

Introduction

Kuo-Hwa Tzeng is a prominent inventor based in Taipei, Taiwan. With an impressive portfolio of 22 patents, he has made significant contributions to the field of semiconductor technology. His expert knowledge and innovative mindset continue to drive advancements in this critical industry.

Latest Patents

Among Kuo-Hwa Tzeng's latest patents is a pioneering **Method for Wafer Bonding Including Edge Trimming**. This patent outlines a sophisticated process where an epitaxial layer is formed on the surface of a first wafer, followed by the formation of a sacrificial layer. The method includes edge trimming the first wafer, removing the sacrificial layer, and subsequently bonding the top surface of the first wafer to a second wafer.

Another notable patent from Tzeng is the **Back-side Deep Trench Isolation Structure for Image Sensor**. This innovation details an image sensor design featuring a photodiode encased in a back-side deep trench isolation structure. The photodiode is specifically structured to convert radiation into electrical signals and is surrounded by a unique doping configuration that enhances functionality and performance.

Career Highlights

Kuo-Hwa Tzeng is an integral part of Taiwan Semiconductor Manufacturing Company Limited, a leading firm in semiconductor manufacturing. His technical expertise and innovative spirit have allowed him to achieve numerous accomplishments throughout his career.

Collaborations

Throughout his journey, Tzeng has collaborated with talented individuals in the field, including colleagues Yeur-Luen Tu and Cheng-Yuan Tsai. These collaborations have fostered a productive environment, leading to groundbreaking advancements in semiconductor technologies and applications.

Conclusion

Kuo-Hwa Tzeng exemplifies the spirit of innovation in the semiconductor industry. His extensive patent portfolio, combined with dedicated collaboration and a passion for technological advancement, ensures that his contributions will continue to impact the field for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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