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Kazunari Maki

USPTO Granted Patents = 42

EPO Patents = 10 (Patent Applications = 15)

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 29(Granted Patents)

Location History:

Kitamoto, JP (2015)
Saitama, JP (2014 - 2023)
Aizuwakamatsu, JP (2021 - 2024)

Company Filing History:

42 out of 1,530

Mitsubishi Materials Corporation

Mitsubishi Shindoh Co., Ltd.

where one patent can have more than one assignee

Years Active: 2014-2025

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Areas of Expertise:

Copper Alloy

Electronic Devices

Heat Dissipation Substrate

Superconducting Wire

Plastically Worked Material

Insulating Substrate

Terminal Material

Bus Bar

Sputtering Target

Power Module Substrate

Thin Film Transistor

Conductive Component

42 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12359284 - Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate (2025-07-15),

2. 12286698 - Pure copper material, insulating substrate, and electronic device (2025-04-29),

3. 12281376 - Slit copper material, part for electric/electronic device, bus bar, heat dissipation substrate (2025-04-21),

4. 12264407 - Cu—Ni—Si based copper alloy plate, Cu—Ni—Si based copper alloy plate with plating film, and methods of producing the same (2025-04-01),

5. 12264390 - Pure copper material, insulating substrate, and electronic device (2025-04-01),

6. 12203158 - Copper alloy, copper alloy plastic working material, component for electronic/electrical device, terminal, bus bar, lead frame, and heat dissipation substrate (2025-01-21),

7. 11926889 - Copper alloy plate, copper alloy plate with plating film, and methods for producing these (2024-03-12),

8. 11920228 - Copper alloy sheet, copper alloy sheet with plating film, and method for producing same (2024-03-05),

9. 11905614 - Terminal material for connector (2024-02-20),

10. 11795525 - Copper alloy plate, copper alloy plate with plating film, and manufacturing method thereof (2023-10-24),

11. 11781234 - Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products (2023-10-10),

12. 11655523 - Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar (2023-05-23),

13. 11613794 - Superconductivity stabilizing material, superconducting wire and superconducting coil (2023-03-28),

14. 11572633 - Tin-plated copper terminal material and method of manufacturing the same (2023-02-07),

15. 11319615 - Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay (2022-05-03),

Title: Kazunari Maki - Innovative Inventor from Saitama, JP

Introduction: Kazunari Maki is a renowned inventor hailing from Saitama, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kazunari Maki's latest patents include cutting-edge advancements in robotics, artificial intelligence, and sustainable energy solutions, showcasing his commitment to pushing the boundaries of technological development.

Career Highlights: With a career spanning over two decades, Kazunari Maki has worked with leading research institutions and tech companies, consistently delivering innovative solutions that have revolutionized various industries.

Collaborations: Throughout his career, Kazunari Maki has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of creativity and excellence in all his projects.

Conclusion: Kazunari Maki's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology in Japan and beyond.

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