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Mitsubishi Materials Corporation

USPTO Granted Patents = 1,530

CIPO Patents = 11

EPO Patents = 600

Trademarks = 43

Forward Citations = 9,795

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1,508 inventors (with patents filed for the assignee):

Yoshiyuki Nagatomo (68 out of 68 patents)

Nobuyuki Terasaki (52 out of 52 patents)

Hideaki Sakurai (48 out of 49 patents)

4. Kazunari Maki (42 out of 42 patents)

5. Nobuyuki Soyama (40 out of 41 patents)

6. Yoshirou Kuromitsu (34 out of 37 patents)

7. Kazuhiko Yamasaki (28 out of 28 patents)

8. Koji Hoshino (27 out of 27 patents)

9. Kiyotaka Nakaya (26 out of 26 patents)

10. Katsumi Ogi (26 out of 30 patents)

11. Tatsuo Arai (26 out of 54 patents)

12. Takayoshi Saito (25 out of 35 patents)

13. Toshiaki Ueda (23 out of 46 patents)

14. Hidehiko Nagaya (23 out of 23 patents)

15. Hiroshi Tanaka (23 out of 153 patents)

Core Competencies:

Copper-Ceramic Bonded Body

Insulated Circuit Board

Cutting Tool

Copper Alloy

Heat Dissipation Substrate

Surface-Coated Cutting Tool

Thermoelectric Conversion Module

Plasma Processing Device

Infrared Shielding Film

Electronic Component Mounting Substrate

Sintered Body

Insulating Resin Circuit Substrate

1,530 patents: Sort by Forward Citations

1. 12451404 - Copper-ceramic bonded body, insulated circuit board, method for producing copper-ceramic bonded body, and method for producing insulated circuit board (2025-10-21),

2. 12420344 - Base material for hard sintered body, hard sintered body, and cutting tool (2025-09-23),

3. 12410102 - CBN sintered body and cutting tool (2025-09-09),

4. 12391569 - Black material and method for producing same, black photosensitive composition and method for producing same, and black patterning film and method for forming same (2025-08-19),

5. 12385110 - Pure copper plate (2025-08-12),

6. 12359284 - Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate (2025-07-15),

7. 12356554 - Method for manufacturing bonded body and method for manufacturing insulation circuit substrate (2025-07-08),

8. 12350742 - Surface-coated cutting tool (2025-07-08),

9. 12331386 - Pure copper plate (2025-06-17),

10. 12303986 - Rotating tool with coolant hole (2025-05-20),

11. 12303982 - Surface-coated cutting tool (2025-05-20),

12. 12286698 - Pure copper material, insulating substrate, and electronic device (2025-04-29),

13. 12281376 - Slit copper material, part for electric/electronic device, bus bar, heat dissipation substrate (2025-04-21),

14. 12278025 - Insulated copper wire and electric coil (2025-04-14),

15. 12264407 - Cu—Ni—Si based copper alloy plate, Cu—Ni—Si based copper alloy plate with plating film, and methods of producing the same (2025-04-01),

Mitsubishi Materials Corporation is a global manufacturer and supplier of advanced materials and products for various industries. With a focus on innovation and technological advancement, the company offers a wide range of materials including cement, metals, chemicals, and ceramics. Mitsubishi Materials Corporation aims to contribute to the development of society through its commitment to creating sustainable solutions and providing reliable products.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

1,530 Patents

#71 in Tokyo

#146 in Japan

#632 in the World

Mitsubishi Materials Corporation

Forward Citations = 9,795

1,508 inventors:

Yoshiyuki Nagatomo (68 out of 68 patents)

Nobuyuki Terasaki (52 out of 52 patents)

Hideaki Sakurai (48 out of 49 patents)

4. Kazunari Maki (42 out of 42 patents)

5. Nobuyuki Soyama (40 out of 41 patents)

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