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Mitsubishi Materials Corporation

USPTO Granted Patents = 1,555

% Expired Patents = 16.3

CIPO Patents = 11

EPO Patents = 617

Trademarks = 31

Forward Citations = 9,949

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1,545 inventors (with patents filed for the assignee):

Yoshiyuki Nagatomo (68 out of 68 patents)

Nobuyuki Terasaki (56 out of 56 patents)

Hideaki Sakurai (49 out of 49 patents)

4. Kazunari Maki (44 out of 44 patents)

5. Nobuyuki Soyama (41 out of 41 patents)

6. Yoshirou Kuromitsu (34 out of 37 patents)

7. Kazuhiko Yamasaki (28 out of 28 patents)

8. Koji Hoshino (27 out of 27 patents)

9. Kiyotaka Nakaya (26 out of 26 patents)

10. Katsumi Ogi (26 out of 30 patents)

11. Tatsuo Arai (26 out of 54 patents)

12. Takayoshi Saito (25 out of 37 patents)

13. Yuki Ito (23 out of 39 patents)

14. Toshiaki Ueda (23 out of 46 patents)

15. Hidehiko Nagaya (23 out of 23 patents)

Core Competencies:

Insulating Circuit Substrate

Copper/Ceramic Bonded Body

Surface-Coated Cutting Tool

Negative Electrode Material

Copper Alloy

Thermoelectric Conversion Module

Plasma Processing Apparatus

Heat Dissipation Substrate

Copper Base Substrate

Black Photosensitive Composition

Cobalt and Nickel Recovery

Bonded Body

1,555 patents: Sort by Forward Citations

1. 12747163 - Negative electrode material, battery, method for producing negative electrode material, and method for producing battery (2026-09-29),

2. 12746604 - Surface-coated cutting tool (2026-09-29),

3. 12715040 - Method for manufacturing copper alloy powder for metal AM (2026-08-25),

4. 12703893 - Method for recovering valuable metal from used LIB (2026-08-11),

5. 12661867 - Bonding sheet with preform layer, method for manufacturing bonded body, and to-be-bonded member with preform layer (2026-06-23),

6. 12649859 - Aluminum-oxide-based-composition-containing zirconium nitride powder and method for producing same (2026-06-09),

7. 12630905 - Copper alloy, copper alloy plastic working material, component for electronic/electrical devices, terminal, bus bar, lead frame and heat dissipation substrate (2026-05-19),

8. 12630904 - Pure copper plate (2026-05-19),

9. 12628646 - Copper/ceramic assembly and insulating circuit substrate (2026-05-12),

10. 12622269 - Copper/ceramic bonded body and insulating circuit substrate (2026-05-05),

11. 12622268 - Copper/ceramic bonded body and insulating circuit substrate (2026-05-05),

12. 12617694 - Low alpha-ray emission stannous oxide and method of producing the same (2026-05-05),

13. 12610463 - Copper base substrate comprising an insulating layer having a specific relationship between thickness and elastic modulus (2026-04-21),

14. 12597534 - Copper strip for edgewise bending, component for electric or electronic device, and bus bar (2026-04-07),

15. 12580185 - Negative electrode material, battery, production method for negative electrode material, and manufacturing method for battery (2026-03-17),

Company Overview

Mitsubishi Materials Corporation, headquartered in Tokyo, Japan, specializes in the development and manufacturing of advanced materials and components, particularly in the field of insulating circuit substrates. The company is recognized for its expertise in technologies such as copper/ceramic bonded bodies, surface-coated cutting tools, and negative electrode materials. Additionally, Mitsubishi Materials is involved in thermoelectric conversion modules and plasma processing apparatuses, contributing to innovations in heat dissipation substrates and various industrial applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

1,555 Patents

#79 in Tokyo

#149 in Japan

#640 in the World

Mitsubishi Materials Corporation

Forward Citations = 9,949

1,545 inventors:

Yoshiyuki Nagatomo (68 out of 68 patents)

Nobuyuki Terasaki (56 out of 56 patents)

Hideaki Sakurai (49 out of 49 patents)

4. Kazunari Maki (44 out of 44 patents)

5. Nobuyuki Soyama (41 out of 41 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Mitsubishi Materials Corporation. Retrieved from https://idiyas.com/company/mitsubishi-materials

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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