The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Oct. 24, 2023
Mitsubishi Materials Corporation, Tokyo, JP;
Shingo Hirano, Tokyo, JP;
Kiyoyuki Okubo, Tokyo, JP;
Satoshi Kumagai, Sakai, JP;
Jun Kato, Saitama, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A method for manufacturing a copper alloy powder for a metal AM includes a casting step of manufacturing a copper alloy ingot with a casting apparatus including a molten copper supply unit which melts a copper raw material consisting of high-purity copper having a purity of 99.99 mass % or more to obtain molten copper, an addition unit which adds alloy elements of a copper alloy to the molten copper, and a mold to which the molten copper alloy is supplied, and an atomizing treatment step of powdering the copper alloy ingot by performing melting and decomposing by an atomizing treatment in an inert gas or a vacuum atmosphere using the copper alloy ingot, in which the O concentration of the copper alloy ingot is set to 10 mass ppm or less, and the H concentration of the copper alloy ingot is set to 5 mass ppm or less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile