The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Jul. 29, 2022
Mitsubishi Materials Corporation, Tokyo, JP;
Nobuyuki Terasaki, Saitama, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body obtained by bonding copper members consisting of copper or a copper alloy to a ceramic member, where at a bonded interface between the ceramic member and each of the copper members, the distance between the ceramic member and each of the copper members in an end portion of each of the copper members is in a range of 3 μm or more and 30 μm or less, and a void ratio in an end portion region (E) of each of the copper members is 10% or less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile