Saitama, Japan

Nobuyuki Terasaki

This inventor holds 56 USPTO granted patents and 14 published patent applications and 22 EPO patents, primarily in Copper-Ceramic Bonding. Top assignees: Mitsubishi Materials Corporation, The University of Tokyo. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nobuyuki Terasaki. Retrieved from https://idiyas.com/inventor/nobuyuki-terasaki

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 56 

% Patents Active = 96.4

 

Average Co-Inventor Count = 1.6

ph-index = 4

Forward Citations = 65(Granted Patents)

Forward Citations (Not Self Cited) = 43(Dec 10, 2025)


Location History:

  • Okegawa, JP (2016)
  • Kitamoto, JP (2017)
  • Saitama, JP (2015 - 2024)

Company Filing History:


Years Active: 2015-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Copper-Ceramic Bonded Body
Insulating Circuit Substrate
Power Module Substrate
Heat Sink
Ceramic-Aluminum Bonded Body
LED Module
Thermoelectric Module
Bonding Method
Production Method
Copper Member
Ceramic Member
Aluminum Member
56 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Nobuyuki Terasaki

Introduction:

Nobuyuki Terasaki, a prolific inventor based in Saitama, Japan, has made significant contributions to the field of insulated circuit boards with an impressive portfolio of 48 patents. His innovative work in materials science and circuit substrate technology has earned him recognition in the industry. Let's delve into the world of Nobuyuki Terasaki and explore his groundbreaking inventions and career highlights.

Latest Patents:

Among his latest patents is the insulated circuit board, a cutting-edge technology that revolutionizes the construction of circuit substrates. This invention involves laminating aluminum sheets on a ceramic substrate, with a unique solid-solution process that enhances the performance and durability of the circuit board. Terasaki's attention to detail, such as controlling the ratio of copper concentration at various layers, showcases his meticulous approach to innovation.

Career Highlights:

Nobuyuki Terasaki has honed his expertise through his tenure at reputable institutions such as Mitsubishi Materials Corporation and The University of Tokyo. His experience in both industry and academia has provided him with a well-rounded perspective on materials engineering and manufacturing processes. Terasaki's dedication to pushing the boundaries of traditional circuit board design has led to numerous breakthroughs in the field.

Collaborations:

Throughout his illustrious career, Terasaki has collaborated with esteemed colleagues such as Yoshiyuki Nagatomo and Yoshirou Kuromitsu. These partnerships have been instrumental in driving innovation and knowledge sharing within the industry. By working closely with like-minded individuals, Terasaki has been able to synergize his ideas and expertise to create impactful inventions that have paved the way for future advancements in circuit board technology.

Conclusion:

In conclusion, Nobuyuki Terasaki stands as a visionary inventor whose relentless pursuit of innovation has left an indelible mark on the field of circuit substrate technology. His latest patents, career highlights, and collaborations underscore his passion for pushing the boundaries of materials science and engineering. As Terasaki continues to push the envelope of what is possible in the world of insulated circuit boards, the industry eagerly anticipates his future contributions and the impact they will have on shaping the technologies of tomorrow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…