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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12125765 B1

PDFFull Text
Date of Patent:
Oct. 22, 2024

Filed:

Aug. 19, 2020

Copper/ceramic joined body and insulating circuit substrate

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventor:

Nobuyuki Terasaki, Saitama, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorney:

Locke Lord LLP

Primary Examiner:

Michael E La Villa

Int. Cl.
CPC ...
H01L 23/373 (2006.01); B32B 15/00 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); B32B 18/00 (2006.01); C04B 35/645 (2006.01); C04B 37/02 (2006.01); H01L 21/48 (2006.01); H01L 23/12 (2006.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01); H01L 23/36 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); B32B 15/00 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); B32B 18/00 (2013.01); C04B 35/645 (2013.01); C04B 37/021 (2013.01); C04B 37/026 (2013.01); H01L 21/4807 (2013.01); H01L 23/12 (2013.01); H01L 23/13 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6581 (2013.01); C04B 2235/72 (2013.01); C04B 2235/725 (2013.01); C04B 2237/12 (2013.01); C04B 2237/123 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); C04B 2237/50 (2013.01); C04B 2237/52 (2013.01); C04B 2237/525 (2013.01); C04B 2237/60 (2013.01); C04B 2237/704 (2013.01); H01L 23/15 (2013.01); H01L 23/36 (2013.01); H01L 2224/32225 (2013.01); H05K 1/0306 (2013.01); H05K 3/38 (2013.01); Y10T 428/12576 (2015.01); Y10T 428/12597 (2015.01); Y10T 428/12611 (2015.01); Y10T 428/12618 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/1291 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/265 (2015.01);
Abstract

A copper/ceramic bonded body is provided, including: a copper member made of copper or a copper alloy; and a ceramic member, the copper member and the ceramic member being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member and the ceramic member to a copper member side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %.

Find Patent Forward Citations

Terasaki, Nobuyuki. (2024). Copper/ceramic joined body and insulating circuit substrate (U.S. Patent No. 12125765). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12125765

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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