The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Jul. 29, 2022
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventor:
Nobuyuki Terasaki, Saitama, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 24/32 (2013.01);
Abstract
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body obtained by bonding copper members consisting of copper or a copper alloy to a ceramic member, where in an edge region E of each of the copper members, an area ratio of each of Ag solid solution parts having an Ag concentration of 0.5% by mass or more and 15% by mass or less is set in a range of 0.03 or more and 0.35 or less.
Terasaki, Nobuyuki. (2026). Copper/ceramic bonded body and insulating circuit substrate (U.S. Patent No. 12622269). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12622269
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile