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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12027434 B1

PDFFull Text
Date of Patent:
Jul. 02, 2024

Filed:

Jan. 16, 2019

Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventor:

Nobuyuki Terasaki, Saitama, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Mary I Omori

Int. Cl.
CPC ...
B32B 15/20 (2006.01); B23K 20/16 (2006.01); C04B 37/02 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); B32B 15/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/142 (2013.01); B23K 20/165 (2013.01); C04B 37/02 (2013.01); H01L 23/3731 (2013.01); H01L 23/3735 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01);
Abstract

A bonded body of copper and ceramic includes: a copper member made of copper or a copper alloy and a ceramic member made of an aluminum oxide, the copper member and the ceramic member being bonded to each other; a magnesium oxide layer which is formed on a ceramic member side between the copper member and the ceramic member; and a Mg solid solution layer which is formed between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase, in which one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer.

Find Patent Forward Citations

Terasaki, Nobuyuki. (2024). Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method (U.S. Patent No. 12027434). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12027434

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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