The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Jul. 15, 2022
Mitsubishi Materials Corporation, Tokyo, JP;
Nobuyuki Terasaki, Saitama, JP;
Akira Sakurai, Saitama, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
This copper/ceramic assembly includes: a copper member consisting of copper or a copper alloy; and a ceramic member, wherein the copper member and the ceramic member are bonded to each other. At a bonded interface between the ceramic member and the copper member, an active metal compound layer is formed on a side of the ceramic member. In a region extending by 10 μm from the active metal compound layer toward a side of the copper member, an area rate of an active metal carbide is 8% or less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile