The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2024
Filed:
Aug. 13, 2020
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventor:
Nobuyuki Terasaki, Saitama, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); B23K 20/10 (2006.01); C04B 37/02 (2006.01); B23K 103/12 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); B23K 20/10 (2013.01); C04B 37/026 (2013.01); B23K 2103/12 (2018.08); B23K 2103/52 (2018.08); C04B 2237/124 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); Y10T 428/12576 (2015.01);
Abstract
This copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of silicon nitride, wherein the copper member and the ceramic member are bonded to each other, a Mg—N compound phase extending from a ceramic member side to a copper member side is present at a bonded interface between the copper member and the ceramic member, and at least a part of the Mg—N compound phase enters into the copper member.