The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Mar. 02, 2022
Mitsubishi Materials Corporation, Tokyo, JP;
Daiki Furuyama, Sanda, JP;
Takuma Katase, Sanda, JP;
Kohei Otogawa, Sanda, JP;
Junta Inoue, Sanda, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
This bonding sheet () with a preform layer () is a bonding sheet () for bonding a substrate () and an electronic component (), the bonding sheet () includes a copper sheet () and a porous preform layer () including copper particles () provided on one surface or both surfaces of the copper sheet (), in which surfaces of the copper particles () are coated with copper nanoparticles () having an average particle diameter smaller than an average particle diameter of the copper particles (), the average particle diameter of the copper nanoparticles () calculated from a BET value is 9.59 nm or more and 850 nm or less, and an average porosity of the preform layer () is 11% or more and 78% or less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile