The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Jun. 30, 2021
Mitsubishi Materials Corporation, Tokyo, JP;
Hirotaka Matsunaga, Kitamoto, JP;
Kosei Fukuoka, Kitamoto, JP;
Kazunari Maki, Kitamoto, JP;
Kenji Morikawa, Aizuwakamatsu, JP;
Shinichi Funaki, Aizuwakamatsu, JP;
Hiroyuki Mori, Sakai, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
This copper alloy contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise: 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater. The half-softening temperature ratio T/Tis greater than 0.95 and less than 1.08. The half-softening temperature Tis 210° C. or higher.