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For the Inventor, By the Inventor

Okegawa, Japan

Hirotaka Matsunaga

This inventor holds 17 USPTO granted patents and 5 EPO patents, primarily in Copper Alloys. Top assignee: Mitsubishi Materials Corporation. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirotaka Matsunaga. Retrieved from https://idiyas.com/inventor/hirotaka-matsunaga

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 17(Granted Patents)


Location History:

  • Okegawa, JP (2018 - 2020)
  • Kitamoto, JP (2021 - 2023)
  • Aizuwakamatsu, JP (2023 - 2024)

Company Filing History:

goldMedal17 out of 1,556 
 
Mitsubishi Materials Corporation
 patents

Years Active: 2018-2026

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Areas of Expertise:
Copper Alloy
Electronic Devices
Heat Dissipation Substrate
Bus Bar
Terminal
Plastic Working Material
Lead Frame
Insulated Circuit Board
Slit Copper Material
Copper/Ceramic Bonded Body
Planar Bar Stock
Sheet/Strip Material
17 patents (USPTO):Explore Patents
1. 12630905 - Copper alloy, copper alloy plastic working material, component for electronic/electrical devices, terminal, bus bar, lead frame and heat dissipation substrate (2026-05-19),
2. 12630904 - Pure copper plate (2026-05-19),
3. 12359284 - Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate (2025-07-15),
4. 12331386 - Pure copper plate (2025-06-17),
5. 12281376 - Slit copper material, part for electric/electronic device, bus bar, heat dissipation substrate (2025-04-21),
6. 12203158 - Copper alloy, copper alloy plastic working material, component for electronic/electrical device, terminal, bus bar, lead frame, and heat dissipation substrate (2025-01-21),
7. 12035469 - Pure copper plate, copper/ceramic bonded body, and insulated circuit board (2024-07-09),
8. 11732329 - Copper alloy, copper alloy plastic-processed material, component for electronic and electric devices, terminal, bus bar, and heat-diffusing substrate (2023-08-22),
9. 11725258 - Copper alloy for electronic/electrical devices, copper alloy planar bar stock for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar (2023-08-15),
10. 11655523 - Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar (2023-05-23),
11. 11319615 - Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay (2022-05-03),
12. 11203806 - Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay (2021-12-21),
13. 11104977 - Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar (2021-08-31),
14. 10676803 - Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar (2020-06-09),
15. 10453582 - Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar (2019-10-22),

Title: Innovations of Hirotaka Matsunaga

Introduction

Hirotaka Matsunaga is a prominent inventor based in Okegawa, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper alloys and pure copper materials. With a total of 15 patents to his name, Matsunaga's work has had a substantial impact on electronic and electrical equipment.

Latest Patents

Matsunaga's latest patents include innovations such as a copper alloy that contains 10-100 mass ppm of magnesium, with the balance being copper and inevitable impurities. This alloy is designed for use in components for electronic and electrical equipment, featuring excellent electrical conductivity of 97% IACS or greater. Another notable patent is for a pure copper sheet that includes 99.96 mass % or more of copper, with specific limits on phosphorus and other elements, ensuring high quality and performance.

Career Highlights

Matsunaga is currently employed at Mitsubishi Materials Corporation, where he continues to push the boundaries of material innovation. His work has been recognized for its technical excellence and practical applications in various industries.

Collaborations

Matsunaga collaborates with esteemed colleagues such as Kazunari Maki and Hiroyuki Mori, contributing to a dynamic research environment that fosters innovation and development.

Conclusion

Hirotaka Matsunaga's contributions to the field of materials science exemplify the spirit of innovation. His patents reflect a commitment to advancing technology and improving the performance of materials used in electronic applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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