The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Mar. 29, 2017
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Hirotaka Matsunaga, Kitamoto, JP;
Kazunari Maki, Saitama, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C22C 9/02 (2006.01); H01B 1/02 (2006.01); C22F 1/08 (2006.01); C22F 1/00 (2006.01);
U.S. Cl.
CPC ...
C22F 1/08 (2013.01); C22C 9/00 (2013.01); C22C 9/02 (2013.01); C22F 1/002 (2013.01); H01B 1/026 (2013.01);
Abstract
Provided is a copper alloy for electronic and electrical equipment including: 0.15 mass % or greater and less than 0.35 mass % of Mg; 0.0005 mass % or greater and less than 0.01 mass % of P; and a remainder which is formed of Cu and unavoidable impurities, in which a conductivity is greater than 75% IACS, and an average number of compounds containing Mg and P with a particle diameter of 0.1 μm or greater is 0.5 pieces/μmor less in observation using a scanning electron microscope.