The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Sep. 08, 2016
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Hirotaka Matsunaga, Okegawa, JP;
Kazunari Maki, Saitama, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C22C 9/00 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01); H01B 5/02 (2006.01); H02G 5/00 (2006.01);
U.S. Cl.
CPC ...
H01B 1/026 (2013.01); C22C 9/00 (2013.01); C22F 1/08 (2013.01); H01B 5/02 (2013.01); C22F 1/00 (2013.01); H02G 5/00 (2013.01);
Abstract
A copper alloy for and electric and an electronic device is provided. The copper alloy includes: Mg in a range of 0.15 mass % or more and less than 0.35 mass %; Pin a range of 0.0005 mass % or more and less than 0.01 mass %; and a Cu balance including inevitable impurities. In the copper alloy, a Mg content [Mg] and a P content [P], both of which are in a mass ratio, satisfy a relationship expressed by [Mg]+20×[P]<0.5, and an electrical conductivity of the copper alloy is more than 75% IACS.