The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Nov. 27, 2020
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Hirotaka Matsunaga, Aizuwakamatsu, JP;
Yuki Ito, Ageo, JP;
Hiroyuki Mori, Tsukuba, JP;
Hiroyuki Matsukawa, Iwaki, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C22C 1/04 (2023.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); C22C 1/0425 (2013.01); C22C 2200/00 (2013.01); H01B 1/026 (2013.01);
Abstract
A copper alloy has a composition including: 70 mass ppm or more and 400 mass ppm or less of Mg; 5 mass ppm or more and 20 mass ppm or less of Ag; less than 3.0 mass ppm of P; and a Cu balance containing inevitable impurities. In the copper alloy, the electrical conductivity is 90% IACS or more, and the average value of KAM values is 3.0 or less.