The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Jul. 27, 2023
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Yuki Ito, Kitamoto, JP;
Takumi Odaira, Kitamoto, JP;
Kenichiro Kawasaki, Kitamoto, JP;
Kazunari Maki, Kitamoto, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); H01L 23/00 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); H01L 23/15 (2013.01); H01L 23/49866 (2013.01); H01L 24/32 (2013.01);
Abstract
This pure copper material includes Cu in an amount of 99.96 mass % or more, either one or both of one or more A-group elements selected from Ca, Ba, Sr, Zr, Hf, Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and one or more B-group elements selected from O, S, Se, and Te are included in a total amount of 10 mass ppm or more and 300 mass ppm or less, an average crystal grain size in a rolled surface is 15 μm or more, and a high-temperature Vickers hardness at 850° C. is 4.0 HV or more and 10.0 HV or less.