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For the Inventor, By the Inventor

Tainan, Taiwan

Jung-Chih Tsao

This inventor holds 41 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Fabrication. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., TSMC Nanjing Company, Limited, Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jung-Chih Tsao. Retrieved from https://idiyas.com/inventor/jung-chih-tsao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 41 

% Patents Active = 78.0

Average Co-Inventor Count = 4.6

ph-index = 6

Forward Citations = 98(Granted Patents)


Location History:

  • Taipei, TW (2006 - 2013)
  • Tainian, TW (2017)
  • Hsin-Chu, TW (2006 - 2023)
  • Tainan, TW (2010 - 2023)
  • Hsinchu, TW (2024)

Company Filing History:

goldMedal39 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal4 out of 113 
 
TSMC Nanjing Company, Limited
 patents
bronzeMedal1 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents
4. 1 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 2006-2026

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Areas of Expertise:
Image Sensing Device
Deep Trench Isolation
Metal Gate Structure
Semiconductor Device
Interconnects
Barrier Layer
Damascene Structures
Copper Film Quality
Recess Manufacturing
Via Structure
Multi-Layer Interconnect
Stress-Neutralized Film
41 patents (USPTO):Explore Patents
1. 12557401 - Method of forming deep trench isolation in radiation sensing substrate and image sensor device (2026-02-17),
2. 12512323 - Method of manufacturing a replacement metal gate device structure (2025-12-30),
3. 12142628 - Method of forming semiconductor device (2024-11-12),
4. 12051617 - Method of making a semiconductor device and semiconductor device (2024-07-30),
5. 11854980 - Method for forming titanium nitride barrier with small surface grains in interconnects (2023-12-26),
6. 11769669 - Replacement metal gate device structure and method of manufacturing same (2023-09-26),
7. 11450557 - Poisoned metal layer with sloped sidewall for making dual damascene interconnect (2022-09-20),
8. 11417700 - Image sensing device and manufacturing method thereof (2022-08-16),
9. 11404470 - Method of forming deep trench isolation in radiation sensing substrate and image sensor device (2022-08-02),
10. 11387274 - Method of forming semiconductor device (2022-07-12),
11. 10867889 - Method of manufacturing semiconductor structure (2020-12-15),
12. 10840330 - Block layer in the metal gate of MOS devices (2020-11-17),
13. 10796996 - Semiconductor device and method of forming the same (2020-10-06),
14. 10741601 - Image sensing device and manufacturing method thereof (2020-08-11),
15. 10510798 - Method of forming deep trench isolation in radiation sensing substrate and image sensor device (2019-12-17),

Title: Jung-Chih Tsao: Innovator from Tainan

Introduction: Jung-Chih Tsao is a renowned inventor hailing from Tainan, Taiwan, known for his groundbreaking contributions to various fields.

Latest Patents: Jung-Chih Tsao holds several patents in the areas of technology and engineering, showcasing his innovative mindset and problem-solving abilities.

Career Highlights: Throughout his career, Jung-Chih Tsao has demonstrated a keen interest in developing cutting-edge solutions, leading to the successful implementation of numerous inventions that have had a significant impact on the industry.

Collaborations: Jung-Chih Tsao has collaborated with leading researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge exchange.

Conclusion: Jung-Chih Tsao's dedication to innovation and his passion for creating impactful inventions have solidified his reputation as a pioneering inventor in Tainan and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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