Jun Zhai

This inventor holds 101 USPTO granted patents and 41 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L25-18). Top assignees: Apple Inc., Advanced Micro Devices Corporation, Globalfoundries Inc.. Active years: 2007-2026.

USPTO Granted Patents = 101 (Patent Applications = 41)

% Patents Active = 96.0

EPO Patents = 1 (Patent Applications = 4)

Average Co-Inventor Count = 3.0

ph-index = 12

Forward Citations = 740(Granted Patents)

Forward Citations (Not Self Cited) = 569(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Mountain View, CA (US) (2007 - 2013)
Campbell, CA (US) (2017)
San Jose, CA (US) (2010 - 2024)
Cupertino, CA (US) (2016 - 2024)

Company Filing History:

Advanced Micro Devices Corporation

Advanced Semiconductor Engineering, Inc.

Years Active: 2007-2026

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Areas of Expertise:

Die Stitching

3D Interconnects

Voltage Regulation

Wafer Level Integration

Microelectronic Packaging

Thermal Management

Chip-on-Wafer Bonding

Fanout Interposer

Hybrid Thermal Interface

Silicon IC Sealing

Flexible Package Architecture

Multi-Die Integration

101 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12702028 - Semiconductor package with local interconnect and chiplet integration (2026-08-04),

2. 12588494 - Die stitching and harvesting of arrayed structures (2026-03-24),

3. 12550412 - Structure and method for fabricating a computing system with an integrated voltage regulator module (2026-02-10),

4. 12506117 - Wafer level integration of passive devices (2025-12-23),

5. 12469765 - Thermally enhanced chip-on-wafer or wafer-on-wafer bonding (2025-11-11),

6. 12456692 - Microelectronic package RDL patterns to reduce stress in RDLs across components (2025-10-28),

7. 12451436 - Interconnecting a plurality of dies having spare input/output circuit (2025-10-21),

8. 12368137 - High bandwidth die to die interconnect with package area reduction (2025-07-22),

9. 12322730 - Wafer reconstitution and die-stitching (2025-06-03),

10. 12283549 - High density interconnection using fanout interposer chiplet (2025-04-21),

11. 12261132 - Structure and method for sealing a silicon IC (2025-03-25),

12. 12249599 - Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring (2025-03-11),

13. 12159835 - High density 3D interconnect configuration (2024-12-03),

14. 12119275 - Recessed lid and ring designs and lid local peripheral reinforcement designs (2024-10-15),

15. 12087689 - Selectable monolithic or external scalable die-to-die interconnection system methodology (2024-09-10),

Title: Innovations and Patents of Jun Zhai in Cupertino, CA

Introduction

Jun Zhai, an accomplished inventor based in Cupertino, California, has significantly impacted the field of electronics with a remarkable portfolio of 89 patents. His innovative contributions have paved the way for advancements in electronic packaging and interconnect technology, enhancing device performance and reliability.

Latest Patents

Among his latest inventions are the high density 3D interconnect configurations, which focus on integrating a 3D interconnect structure into package redistribution layers and chiplets. This innovation promises to enhance input/output (IO) density and improve signal routing quality while ensuring effective power delivery. Additionally, he has developed recessed lid and ring designs alongside lid local peripheral reinforcement designs. These modules are notable for their assembly methods, where a lid covers a component mounted on a substrate, potentially incorporating a stiffener structure for added durability.

Career Highlights

Throughout his career, Jun has worked with prominent technology companies, including Apple Inc. and Advanced Micro Devices Corporation (AMD). His experience in these leading firms contributed to his expertise in developing cutting-edge technologies that push the boundaries of electronic devices.

Collaborations

Jun Zhai has collaborated with talented professionals such as Kunzhong Hu and Chonghua Zhong. These partnerships have fostered an environment of creativity and innovation, enabling them to explore new technological frontiers and develop impactful solutions within the electronics industry.

Conclusion

Jun Zhai continues to be a driving force in innovation and invention, with a noteworthy collection of patents that reflect his commitment to advancing electronic technologies. His work not only contributes to the competitiveness of his employers but also shapes the future of electronic device designs.