The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Nov. 28, 2022
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Wei Chen, San Jose, CA (US);
Yi Xu, Boise, ID (US);
Jie-Hua Zhao, Cupertino, CA (US);
Jun Zhai, Cupertino, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/562 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48225 (2013.01);
Abstract
Microelectronic packages and methods of fabrication are described. In an embodiment, a redistribution layer spans across multiple components, and includes a region of patterned wiring traces that may mitigate stress in the RDL between the multiple components.