IDiyas

For the Inventor, By the Inventor

Cupertino, CA, United States of America

Jie-Hua Zhao

USPTO Granted Patents = 13 

Average Co-Inventor Count = 4.0

ph-index = 4

Forward Citations = 58(Granted Patents)


Company Filing History:

goldMedal13 out of 40,816 
 
Apple Inc.
 patents

Years Active: 2015-2025

where 'Filed Patents' based on already Granted Patents

13 patents (USPTO):
1. 12456692 - Microelectronic package RDL patterns to reduce stress in RDLs across components (2025-10-28),
2. 12249599 - Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring (2025-03-11),
3. 12119275 - Recessed lid and ring designs and lid local peripheral reinforcement designs (2024-10-15),
4. 11831312 - Systems and methods for implementing a scalable system (2023-11-28),
5. 11646302 - Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring (2023-05-09),
6. 11561144 - Wearable electronic device with fluid-based pressure sensing (2023-01-24),
7. 11309895 - Systems and methods for implementing a scalable system (2022-04-19),
8. 10742217 - Systems and methods for implementing a scalable system (2020-08-11),
9. 9656856 - Method of lower profile MEMS package with stress isolations (2017-05-23),
10. 9633953 - Methodology to achieve zero warpage for IC package (2017-04-25),
11. 9446941 - Method of lower profile MEMS package with stress isolations (2016-09-20),
12. 9263426 - PoP structure with electrically insulating material between packages (2016-02-16),
13. 8963311 - PoP structure with electrically insulating material between packages (2015-02-24),

Title: Innovations by Jie-Hua Zhao

Introduction

Jie-Hua Zhao is a prominent inventor based in Cupertino, CA, known for his significant contributions to microelectronic packaging technology. With a total of 13 patents to his name, Zhao has made remarkable advancements in the field, particularly in reducing stress in redistribution layers (RDLs) across components.

Latest Patents

Zhao's latest patents include innovative designs for microelectronic packages and methods of fabrication. One notable patent describes microelectronic package RDL patterns that mitigate stress in RDLs between multiple components. This invention features a redistribution layer that spans across various components, incorporating a region of patterned wiring traces. Another significant patent focuses on multiple chip module (MCM) structures, detailing a module that includes first and second components on the top side of a module substrate. This design also features a stiffener structure mounted on the substrate and a lid that covers the components, with the stiffener joined to the lid within a trench formed in the roof of the lid.

Career Highlights

Zhao has established a successful career at Apple Inc., where he has been instrumental in developing cutting-edge technologies in microelectronics. His work has not only advanced the company's product offerings but has also contributed to the broader field of electronics.

Collaborations

Zhao has collaborated with notable colleagues, including Jun Zhai and Kunzhong Hu, to further enhance the innovations in microelectronic packaging.

Conclusion

Jie-Hua Zhao's contributions to microelectronic packaging through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence advancements in technology and improve product performance.

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