The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Sep. 04, 2020
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Wei Chen, Union City, CA (US);
Jie-Hua Zhao, Cupertino, CA (US);
Jun Zhai, Cupertino, CA (US);
Po-Hao Chang, Kaohsiung, TW;
Hsien-Che Lin, Hsinchu, TW;
Ying-Chieh Ke, New Taipei, TW;
Kunzhong Hu, Cupertino, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/24 (2013.01);
Abstract
Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.