Hsien-Che Lin

Title: Hsien-Che Lin: Innovator in Multiple Chip Module Technology

Introduction

Hsien-Che Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of multiple chip module (MCM) technology. With a total of 2 patents, Lin's work focuses on enhancing the efficiency and performance of electronic components.

Latest Patents

Lin's latest patents include innovative designs for multiple chip module structures. One of his notable inventions is the "Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring." This patent describes a module that features a first and second component on the top side of a module substrate. A stiffener structure is mounted on the top side of the module substrate, and a lid is placed on the stiffener structure, covering both components. The stiffener is uniquely joined to the lid within a trench formed in the roof of the lid, providing enhanced structural integrity.

Career Highlights

Hsien-Che Lin is currently employed at Apple Inc., where he continues to push the boundaries of technology. His work has been instrumental in developing advanced MCM structures that are crucial for modern electronic devices.

Collaborations

Lin has collaborated with notable colleagues such as Wei Chen and Jie-Hua Zhao. Their combined expertise has contributed to the successful development of innovative technologies in the field.

Conclusion

Hsien-Che Lin is a key figure in the advancement of multiple chip module technology. His patents reflect a commitment to innovation and excellence in the electronics industry. His contributions will undoubtedly influence future developments in this critical area.