logo

For the Inventor, By the Inventor

Cupertino, CA, United States of America

Kunzhong Hu

This inventor holds 50 USPTO granted patents and 23 published patent applications and 1 EPO patent, primarily in 3D Interconnect Technology. Top assignee: Apple Inc.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kunzhong Hu. Retrieved from https://idiyas.com/inventor/kunzhong-hu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 50 

% Patents Active = 92.0

 

Average Co-Inventor Count = 3.8

ph-index = 10

Forward Citations = 585(Granted Patents)


Company Filing History:

goldMedal50 out of 43,816 
 
Apple Inc.
 patents

Years Active: 2017-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
3D Interconnects
Die-Stitching
Chiplet Integration
Voltage Regulator Module
Thermal Interface Materials
High Bandwidth
Scalable Systems
MCM Package
Wafer Reconstitution
Fanout Interposer
Thermal Management
Integrated Passive Devices
50 patents (USPTO):Explore Patents
1. 12796503 - Bonding structures in semiconductor packages (2026-11-10),
2. 12745661 - Scalable extreme large size substrate integration (2026-09-22),
3. 12702028 - Semiconductor package with local interconnect and chiplet integration (2026-08-04),
4. 12588494 - Die stitching and harvesting of arrayed structures (2026-03-24),
5. 12550412 - Structure and method for fabricating a computing system with an integrated voltage regulator module (2026-02-10),
6. 12469765 - Thermally enhanced chip-on-wafer or wafer-on-wafer bonding (2025-11-11),
7. 12368137 - High bandwidth die to die interconnect with package area reduction (2025-07-22),
8. 12322730 - Wafer reconstitution and die-stitching (2025-06-03),
9. 12283549 - High density interconnection using fanout interposer chiplet (2025-04-21),
10. 12261132 - Structure and method for sealing a silicon IC (2025-03-25),
11. 12249599 - Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring (2025-03-11),
12. 12159835 - High density 3D interconnect configuration (2024-12-03),
13. 12119304 - Very fine pitch and wiring density organic side by side chiplet integration (2024-10-15),
14. 12087689 - Selectable monolithic or external scalable die-to-die interconnection system methodology (2024-09-10),
15. 11967528 - Structure and method for fabricating a computing system with an integrated voltage regulator module (2024-04-23),

Title: The Innovative Journey of Kunzhong Hu

Introduction: Kunzhong Hu, a talented inventor based in Cupertino, CA, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Kunzhong Hu's latest patents include cutting-edge technologies in artificial intelligence, machine learning, and robotics, showcasing his commitment to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Kunzhong Hu has worked with leading tech companies, spearheading research and development projects that have revolutionized the industry. His expertise in software engineering and hardware design has led to the creation of several game-changing products.

Collaborations: Kunzhong Hu has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have resulted in the development of pioneering technologies that have had a lasting impact on society.

Conclusion: Kunzhong Hu's passion for innovation, coupled with his technical acumen, has established him as a visionary inventor in the tech community. His relentless pursuit of excellence continues to inspire the next generation of innovators to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…