Kunzhong Hu

This inventor holds 49 USPTO granted patents and 22 published patent applications and 1 EPO patent, primarily in 3D Interconnect Technology. Top assignee: Apple Inc.. Active years: 2017-2026.

USPTO Granted Patents = 49 (Patent Applications = 22)

% Patents Active = 93.9

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 3.8

ph-index = 10

Forward Citations = 562(Granted Patents)

Company Filing History:

49 out of 43,427

Apple Inc.

patents

Years Active: 2017-2026

Loading Chart...

Areas of Expertise:

3D Interconnects

Die-Stitching

Chiplet Integration

Voltage Regulator Module

Thermal Interface Materials

High Bandwidth

Scalable Systems

MCM Package

Wafer Reconstitution

Fanout Interposer

Thermal Management

Integrated Passive Devices

49 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12745661 - Scalable extreme large size substrate integration (2026-09-22),

2. 12702028 - Semiconductor package with local interconnect and chiplet integration (2026-08-04),

3. 12588494 - Die stitching and harvesting of arrayed structures (2026-03-24),

4. 12550412 - Structure and method for fabricating a computing system with an integrated voltage regulator module (2026-02-10),

5. 12469765 - Thermally enhanced chip-on-wafer or wafer-on-wafer bonding (2025-11-11),

6. 12368137 - High bandwidth die to die interconnect with package area reduction (2025-07-22),

7. 12322730 - Wafer reconstitution and die-stitching (2025-06-03),

8. 12283549 - High density interconnection using fanout interposer chiplet (2025-04-21),

9. 12261132 - Structure and method for sealing a silicon IC (2025-03-25),

10. 12249599 - Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring (2025-03-11),

11. 12159835 - High density 3D interconnect configuration (2024-12-03),

12. 12119304 - Very fine pitch and wiring density organic side by side chiplet integration (2024-10-15),

13. 12087689 - Selectable monolithic or external scalable die-to-die interconnection system methodology (2024-09-10),

14. 11967528 - Structure and method for fabricating a computing system with an integrated voltage regulator module (2024-04-23),

15. 11862557 - Selectable monolithic or external scalable die-to-die interconnection system methodology (2024-01-02),

Title: The Innovative Journey of Kunzhong Hu

Introduction: Kunzhong Hu, a talented inventor based in Cupertino, CA, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Kunzhong Hu's latest patents include cutting-edge technologies in artificial intelligence, machine learning, and robotics, showcasing his commitment to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Kunzhong Hu has worked with leading tech companies, spearheading research and development projects that have revolutionized the industry. His expertise in software engineering and hardware design has led to the creation of several game-changing products.

Collaborations: Kunzhong Hu has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have resulted in the development of pioneering technologies that have had a lasting impact on society.

Conclusion: Kunzhong Hu's passion for innovation, coupled with his technical acumen, has established him as a visionary inventor in the tech community. His relentless pursuit of excellence continues to inspire the next generation of innovators to push the boundaries of what is possible in the world of technology.