The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Oct. 17, 2023
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Sanjay Dabral, Cupertino, CA (US);
Jun Zhai, Cupertino, CA (US);
Jung-Cheng Yeh, Sunnyvale, CA (US);
Kunzhong Hu, Cupertino, CA (US);
Raymundo Camenforte, San Jose, CA (US);
Thomas Hoffmann, Los Gatos, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 23/58 (2006.01); H01L 25/065 (2023.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 23/481 (2013.01); H01L 23/5386 (2013.01); H01L 23/585 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 21/78 (2013.01); H01L 22/20 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/30181 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01);
Abstract
Multi-die structures and methods of fabrication are described. In an embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing, or external package-level die-to-die routing.