Jung-Cheng Yeh

Title: Innovations of Jung-Cheng Yeh

Introduction

Jung-Cheng Yeh is a prominent inventor based in San Jose, CA. He has made significant contributions to the field of technology, particularly in the area of multi-die structures and interconnection systems. With a total of four patents to his name, Yeh continues to push the boundaries of innovation.

Latest Patents

One of his latest patents is the "Selectable monolithic or external scalable die-to-die interconnection system methodology." This patent describes multi-die structures and methods of fabrication. In this embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing or external package-level die-to-die routing.

Career Highlights

Yeh has established a successful career at Apple Inc., where he has been instrumental in developing advanced technologies. His work focuses on enhancing the efficiency and scalability of electronic systems.

Collaborations

Throughout his career, Jung-Cheng Yeh has collaborated with notable colleagues, including Sanjay Dabral and Jun Zhai. These collaborations have further enriched his contributions to the field.

Conclusion

Jung-Cheng Yeh's innovative work in multi-die structures and interconnection systems exemplifies his commitment to advancing technology. His patents reflect a deep understanding of complex electronic systems and their fabrication methods.