The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
May. 14, 2021
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 23/532 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/56 (2013.01); H01L 22/12 (2013.01); H01L 23/31 (2013.01); H01L 23/53228 (2013.01); H01L 23/5386 (2013.01); H01L 25/0655 (2013.01);
Abstract
Structures and methods of forming fine die-to-die interconnect routing are described. In an embodiment, a package includes a package-level RDL than spans across a die set and includes a plurality of die-to-die interconnects connecting contact pads between each die. In an embodiment, the plurality of die-to-die interconnects is embedded within one or more photoimageable organic dielectric layers.