Zhitao Cao

Title: Zhitao Cao: Innovator in Electronic Packaging Technologies

Introduction

Zhitao Cao is a prominent inventor based in Campbell, CA (US), known for his significant contributions to electronic packaging technologies. With a total of 8 patents, he has made remarkable advancements in the field, particularly in high-density interconnect configurations.

Latest Patents

Cao's latest patents include innovative electronic package structures and systems that integrate a 3D interconnect structure into a package redistribution layer and/or chiplet. This design enhances power and signal delivery to a die, significantly improving input-output (IO) density and routing quality for signals while maintaining feasible power delivery. Another notable patent focuses on very fine pitch and wiring density for organic side-by-side chiplet integration. This involves forming fine die-to-die interconnect routing, where a package-level redistribution layer spans across a die set, connecting contact pads between each die with embedded die-to-die interconnects within photoimageable organic dielectric layers.

Career Highlights

Throughout his career, Zhitao Cao has worked with leading companies in the technology sector, including Apple Inc. and Applied Materials, Inc. His work has been instrumental in pushing the boundaries of electronic packaging and interconnect technologies.

Collaborations

Cao has collaborated with notable professionals in the industry, including Sanjay Dabral and Kunzhong Hu, contributing to various innovative projects and advancements in electronic packaging.

Conclusion

Zhitao Cao's contributions to electronic packaging technologies have established him as a key figure in the field. His innovative patents and collaborations reflect his commitment to advancing technology and improving electronic systems.