The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Mar. 29, 2024
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Vidhya Ramachandran, Cupertino, CA (US);

Jun Zhai, San Jose, CA (US);

Chonghua Zhong, Cupertino, CA (US);

Kunzhong Hu, Cupertino, CA (US);

Shawn Searles, Austin, TX (US);

Joseph T. Dibene, II, Corralitos, CA (US);

Mengzhi Pang, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/77 (2017.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 25/03 (2006.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 21/77 (2013.01); H01L 22/20 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/03 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 24/17 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/24195 (2013.01); H01L 2924/12 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19104 (2013.01);
Abstract

Systems including voltage regulator circuits are disclosed. In one embodiment, an apparatus includes a voltage regulator controller integrated circuit (IC) die including one or more portions of a voltage regulator circuit. The apparatus further includes a capacitor die, an inductor die, and an interconnect layer arranged over the voltage regulator controller IC die, the capacitor die and the inductor die. The interconnect provides electrical connections between the voltage regulator controller IC die, the capacitor die and the inductor die to form the voltage regulator circuit. In a further embodiment, the voltage regulator controller IC die, the capacitor die and the inductor die are arranged in a planar fashion within a voltage regulator module. In still another embodiment, a system IC is coupled to the voltage regulator module and includes one or more functional circuit blocks coupled to receive a regulated supply voltage generated by the voltage regulator circuit.


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