IDiyas

For the Inventor, By the Inventor

Cupertino, CA, United States of America

Chonghua Zhong

USPTO Granted Patents = 20 

Average Co-Inventor Count = 4.1

ph-index = 5

Forward Citations = 108(Granted Patents)


Location History:

  • Cupertio, CA (US) (2020 - 2021)
  • Cupertino, CA (US) (2017 - 2024)

Company Filing History:

goldMedal20 out of 40,816 
 
Apple Inc.
 patents

Years Active: 2017-2025

where 'Filed Patents' based on already Granted Patents

20 patents (USPTO):
1. 12368137 - High bandwidth die to die interconnect with package area reduction (2025-07-22),
2. 12283549 - High density interconnection using fanout interposer chiplet (2025-04-21),
3. 11967528 - Structure and method for fabricating a computing system with an integrated voltage regulator module (2024-04-23),
4. 11670548 - Structure and method for fabricating a computing system with an integrated voltage regulator module (2023-06-06),
5. 11594494 - High density interconnection using fanout interposer chiplet (2023-02-28),
6. 11587909 - High bandwidth die to die interconnect with package area reduction (2023-02-21),
7. 11404337 - Scalable extreme large size substrate integration (2022-08-02),
8. 11158621 - Double side mounted large MCM package with memory channel length reduction (2021-10-26),
9. 11069665 - Trimmable banked capacitor (2021-07-20),
10. 10943869 - High density interconnection using fanout interposer chiplet (2021-03-09),
11. 10818632 - Structure and method for fabricating a computing system with an integrated voltage regulator module (2020-10-27),
12. 10770433 - High bandwidth die to die interconnect with package area reduction (2020-09-08),
13. 10685948 - Double side mounted large MCM package with memory channel length reduction (2020-06-16),
14. 10181455 - 3D thin profile pre-stacking architecture using reconstitution method (2019-01-15),
15. 10103138 - Dual-sided silicon integrated passive devices (2018-10-16),

Title: Achievements of Chonghua Zhong: Innovator in Advanced Interconnection Technologies

Introduction: Chonghua Zhong is a prominent inventor based in Cupertino, CA, who has made significant contributions to the field of interconnection technologies. With a remarkable portfolio of 19 patents, Chonghua has consistently demonstrated his expertise in developing cutting-edge solutions that enhance the functionality and efficiency of computing systems.

Latest Patents: Among Chonghua’s recent innovations are two noteworthy patents. The first describes a high-density interconnection system utilizing a fanout interposer chiplet. This invention outlines multiple component package structures that integrate an interposer chiplet to provide fine routing between components. Encapsulated within an encapsulation layer, this design features a plurality of conductive vias, allowing for electrical connections between various terminals of the components involved.

The second patent is focused on a structure and method for fabricating a computing system that incorporates an integrated voltage regulator module. This system outlines the integration of voltage regulator units with integrated circuit dies within a common package. The voltage regulator module includes a circuit along with passive devices mounted on a shared substrate, facilitating efficient power supply management for the integrated circuit, which may comprise a System-on-a-chip. The innovative design goes further to include an interconnect region with complex wiring configurations, optimizing the overall system architecture.

Career Highlights: Chonghua Zhong’s career is highlighted by his strategic role at Apple Inc., a leading technology company recognized for its innovation and design excellence. His work has significantly propelled advancements in interconnection technologies, reinforcing the company's commitment to delivering state-of-the-art products.

Collaborations: Throughout his tenure, Chonghua has collaborated with esteemed colleagues such as Jun Zhai and Kunzhong Hu. Together, they have contributed to the development of pioneering technologies that advance the field of electronics and computing.

Conclusion: Chonghua Zhong exemplifies the spirit of innovation through his continuous efforts in improving interconnection systems and components. His patents not only demonstrate his technical proficiency but also reflect his dedication to pushing the boundaries of technology. As he continues to work at Apple Inc., his contributions will undoubtedly influence future advancements in the tech industry.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…