The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Dec. 27, 2019
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Kunzhong Hu, Cupertino, CA (US);
Chonghua Zhong, Cupertino, CA (US);
Jiongxin Lu, Cupertino, CA (US);
Jun Zhai, Cupertino, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 25/065 (2006.01); H01L 23/28 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/488 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/145 (2013.01); H01L 21/565 (2013.01); H01L 23/28 (2013.01); H01L 23/488 (2013.01); H01L 24/14 (2013.01); H01L 24/94 (2013.01); H01L 25/0655 (2013.01); H01L 2021/60022 (2013.01);
Abstract
Electronic packages and methods of formation are described in which an interposer is solderlessly connected with a package substrate. The interposer may be stacked on the package substrate and joined with a conductive film, and may be formed on the package substrate during a reconstitution sequence.