Jiongxin Lu

Title: Innovations of Jiongxin Lu in Semiconductor Technology

Introduction

Jiongxin Lu is a prominent inventor based in Cupertino, CA, known for his contributions to semiconductor technology. He holds 3 patents that showcase his innovative approach to electronic packaging and integration.

Latest Patents

One of his latest patents is focused on thermally enhanced chip-on-wafer or wafer-on-wafer bonding. This patent describes semiconductor packages that include an integrated heat spreader and methods of fabrication. In this embodiment, a semiconductor package consists of a first package level and a second package level that includes one or more second-level chiplets. A heat spreader is bonded to the second package level with a metallic layer, which may include one or more intermetallic compounds formed by transient liquid phase bonding.

Another significant patent by Jiongxin Lu is related to scalable extreme large size substrate integration. This patent outlines electronic packages and methods of formation in which an interposer is solderlessly connected with a package substrate. The interposer can be stacked on the package substrate and joined with a conductive film, and it may be formed on the package substrate during a reconstitution sequence.

Career Highlights

Jiongxin Lu is currently employed at Apple Inc., where he continues to push the boundaries of semiconductor technology. His work has significantly impacted the efficiency and performance of electronic devices.

Collaborations

He has collaborated with notable coworkers, including Kunzhong Hu and Jun Zhai, contributing to advancements in their respective fields.

Conclusion

Jiongxin Lu's innovative patents and contributions to semiconductor technology highlight his role as a key inventor in the industry. His work continues to influence the development of advanced electronic packaging solutions.