The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Aug. 12, 2020
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/24 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/24 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01);
Abstract
Package structure with folded die arrangements and methods of fabrication are described. In an embodiment, a package structure includes a first die and vertical interposer side-by-side. A second die is face down on an electrically connected with the vertical interposer, and a local interposer electrically connects the first die with the vertical interposer.
Zhong, Chonghua. (2023). High bandwidth die to die interconnect with package area reduction (U.S. Patent No. 11587909). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11587909
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile