The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Aug. 02, 2016
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Tongbi Jiang, Santa Clara, CA (US);
Jie-Hua Zhao, Cupertino, CA (US);
Peter G. Hartwell, Sunnyvale, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); B81B 7/00 (2006.01); B81C 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81C 3/001 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); B81B 2207/99 (2013.01); B81C 2203/035 (2013.01); B81C 2203/07 (2013.01);
Abstract
MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.