Apple Inc.

Jie-Hua Zhao

Jun Zhai

Kunzhong Hu

Wei Chen

Tongbi T Jiang

Sanjay Dabral

Suk-Kyu Ryu

Bahattin Kilic

Peter George Hartwell

Yizhang Yang

Chih-Ming Chung

Po-Hao Chang

Hsien-Che Lin

Ying-Chieh Ke

Brad G Boozer

James G Horiuchi

Jun Chung Hsu

David MacNeil

William Scott Lee

Ashwin Balasubramanian

Caleb C Han

Yun X Ma

Mark G Walsh

Yi Xu

Microelectronic packages and methods of fabrication are described. In an embodiment, a redistribution layer spans across multiple components, and includes a region of patterned wiring traces that may mitigate stress in the RDL between the multiple components.

Microelectronic package RDL patterns to reduce stress in RDLs across components

Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring

Modules and methods of assembly are described. A module includes a lid mounted on a module substrate and covering a component. A stiffener structure may optionally be mounted between the lid and module substrate. A recess can be formed in any of an outer wall bottom surface of the lid, and top or bottom surface of the stiffener structure such that an adhesive layer at least partially fills the recess.

Recessed lid and ring designs and lid local peripheral reinforcement designs

Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.

Systems and methods for implementing a scalable system

An electronic device, such as a smart watch, incorporating a fluid-based pressure-sensing device is disclosed. The fluid-based pressure-sensing device includes an enclosure, a pressure sensor, a diaphragm and a sensing medium. The enclosure includes an opening and the pressure sensor is disposed inside the enclosure. The diaphragm hermetically seals the opening, and the sensing medium transfers a pressure exerted on the diaphragm to the pressure sensor. The sensing medium can be liquid oil filling a space of the enclosure, and the diaphragm is a polymer material. The pressure-sensing device may sense an environmental pressure, which may be used by the electronic device to modify its operations, change information that is displayed, and so on.

Wearable electronic device with fluid-based pressure sensing

MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.

Method of lower profile MEMS package with stress isolations

A methodology for addressing package warpage is described. In an embodiment a package includes a die mounted on a wiring board. Portion of a metal plane within the wiring board includes a reduced portion, characterized by a reduced thickness that is less than a baseline thickness.

Methodology to achieve zero warpage for IC package

A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages.

PoP structure with electrically insulating material between packages

Growing community of inventors

Cupertino, CA, United States of America

Jie-Hua Zhao