This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Apple Inc.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Yi Xu - Innovator in Microelectronic Packaging
Introduction
Yi Xu is a notable inventor based in Boise, Idaho, recognized for his contributions to the field of microelectronics. He has developed innovative solutions that address critical challenges in microelectronic packaging.
Latest Patents
Yi Xu holds a patent for "Microelectronic package RDL patterns to reduce stress in RDLs across components." This patent describes microelectronic packages and methods of fabrication. In one embodiment, a redistribution layer spans across multiple components and includes a region of patterned wiring traces that may mitigate stress in the RDL between the multiple components.
Career Highlights
Yi Xu is currently employed at Apple Inc., where he applies his expertise in microelectronics to advance the company's technological innovations. His work focuses on enhancing the reliability and performance of microelectronic packages.
Collaborations
Yi Xu collaborates with Jie-Hua Zhao, contributing to the development of cutting-edge technologies in the microelectronics sector.
Conclusion
Yi Xu's innovative work in microelectronic packaging exemplifies the importance of addressing stress in electronic components, showcasing his significant contributions to the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile