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For the Inventor, By the Inventor

Taipei, Taiwan

Jing Ruei Lu

USPTO Granted Patents = 16 

Average Co-Inventor Count = 5.2

ph-index = 4

Forward Citations = 38(Granted Patents)


Company Filing History:

goldMedal16 out of 40,848 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2023

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16 patents (USPTO):Explore Patents
1. 11725120 - Carrier tape system and methods of making and using the same (2023-08-15),
2. 11417643 - Package-on-package with redistribution structure (2022-08-16),
3. 11133285 - Package-on-package structure having polymer-based material for warpage control (2021-09-28),
4. 10515941 - Methods of forming package-on-package structures (2019-12-24),
5. 10269763 - Package-on-package structure having polymer-based material for warpage control (2019-04-23),
6. 9887144 - Ring structure for chip packaging (2018-02-06),
7. 9859265 - Package structure and methods of forming the same (2018-01-02),
8. 9793242 - Packages with die stack including exposed molding underfill (2017-10-17),
9. 9666556 - Flip chip packaging (2017-05-30),
10. 9627355 - Package-on-package structure having polymer-based material for warpage control (2017-04-18),
11. 9583474 - Package on packaging structure and methods of making same (2017-02-28),
12. 9349663 - Package-on-package structure having polymer-based material for warpage control (2016-05-24),
13. 9147584 - Rotating curing (2015-09-29),
14. 8993378 - Flip-chip BGA assembly process (2015-03-31),
15. 8946888 - Package on packaging structure and methods of making same (2015-02-03),

Title: Innovator Jing Ruei Lu: Pioneering Semiconductor Packaging Technologies

Introduction: Jing Ruei Lu is a distinguished inventor based in Taipei, Taiwan. With an impressive portfolio of 16 patents, Lu has made significant contributions to the semiconductor industry, particularly in the areas of packaging technologies. His innovative solutions are helping to optimize and enhance the reliability of semiconductor devices.

Latest Patents: Among his latest patents, Lu has developed a "Carrier tape system and methods of making and using the same," which details a carrier tape comprising multiple pockets. Each pocket is designed to securely hold a semiconductor device using a reversible adhesive, minimizing the risk of damage during transportation. Furthermore, Lu holds a patent for a "Package-on-package with redistribution structure," which describes an advanced packaging method that includes a substrate, multiple device dies, and a redistribution structure. These innovations significantly improve the efficiency and effectiveness of semiconductor packaging.

Career Highlights: Jing Ruei Lu is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., where he continues to drive innovation in semiconductor technology. His extensive experience and expertise enable him to contribute to the development of cutting-edge solutions that meet the growing demands of the industry.

Collaborations: Throughout his career, Lu has collaborated with other talented professionals, including Yu-Chih Liu and Wei-Ting Lin. Together, they work on enhancing semiconductor technologies and pushing the boundaries of innovation within their field.

Conclusion: Jing Ruei Lu stands out as a prolific inventor in the semiconductor industry. With 16 patents to his name, his innovations are making a substantial impact on how semiconductor devices are packaged and protected. As he continues to collaborate with fellow experts, the future promises even more groundbreaking advancements from this remarkable inventor.

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