The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Oct. 30, 2019
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); C09J 5/00 (2006.01); H01L 21/683 (2006.01); C09J 7/38 (2018.01); C09J 7/20 (2018.01); H01L 21/673 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
C09J 5/00 (2013.01); C09J 7/20 (2018.01); C09J 7/381 (2018.01); H01L 21/67333 (2013.01); H01L 21/6836 (2013.01); C09J 2203/326 (2013.01); C09J 2301/416 (2020.08); C09J 2301/502 (2020.08); C09J 2427/00 (2013.01); H05K 13/0084 (2013.01);
Abstract
The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.