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For the Inventor, By the Inventor

Taichung, Taiwan

Pei-Haw Tsao

This inventor holds 91 USPTO granted patents and 22 published patent applications, primarily in Semiconductor Packaging (CPC class H01L2224-0401). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Vanguard International Semiconductor Corporation, Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2000-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pei-Haw Tsao. Retrieved from https://idiyas.com/inventor/pei-haw-tsao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 91 

% Patents Active = 80.2

Average Co-Inventor Count = 3.4

ph-index = 15

Forward Citations = 865(Granted Patents)

Forward Citations (Not Self Cited) = 826(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Nan chiu, TW (2003 - 2004)
  • Taichung, CN (2005)
  • Taichung, TW (2000 - 2024)
  • Hsinchu, TW (2008 - 2024)

Company Filing History:

goldMedal87 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 1,132 
 
Vanguard International Semiconductor Corporation
 patents
bronzeMedal1 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2000-2026

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Areas of Expertise:
Semiconductor Structure
Chip Package
Warpage Control
Integrated Fan-Out
Dicing Method
Carrier Tape System
Magnetic Shielding
Stacked Devices
Printed Circuit Board
Manufacturing Method
Conductive Bump
Polymer Layer Delamination
91 patents (USPTO):Explore Patents
1. 12753327 - Carrier tape system and methods of making and using the same (2026-10-06),
2. 12568866 - Semiconductor structure and method of manufacturing the same (2026-03-03),
3. 12463192 - Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrier (2025-11-04),
4. 12417993 - Chip structure (2025-09-16),
5. 12347817 - Semiconductor device package having warpage control (2025-07-01),
6. 12261125 - Method for forming chip package structure (2025-03-25),
7. 12237226 - Dicing method for stacked semiconductor devices (2025-02-25),
8. 12230593 - Wafer level package with polymer layer delamination prevention design and method of forming the same (2025-02-18),
9. 12205859 - Package and printed circuit board attachment (2025-01-21),
10. 12159847 - Integrated fan-out structures and methods for forming the same (2024-12-03),
11. 12051624 - Stacked semiconductor devices and methods of forming thereof (2024-07-30),
12. 12016126 - Carrier tape system and components and methods of use (2024-06-18),
13. 11990423 - Magnetic shielding material with insulator-coated ferromagnetic particles (2024-05-21),
14. 11978729 - Semiconductor device package having warpage control and method of forming the same (2024-05-07),
15. 11894331 - Chip package structure, chip structure and method for forming chip structure (2024-02-06),

Title: The Innovative Journey of Pei-Haw Tsao

Introduction:

Pei-Haw Tsao, a talented inventor hailing from Tai-Chung, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Tsao's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology, and renewable energy solutions.

Career Highlights:

With a career spanning over two decades, Tsao has worked with leading tech companies in Taiwan, spearheading research and development projects that have pushed the boundaries of innovation. His expertise in machine learning and robotics has led to the creation of revolutionary products that have transformed industries.

Collaborations:

Tsao has collaborated with top research institutions and universities worldwide, fostering a culture of innovation and knowledge sharing. His partnerships have resulted in the development of patented technologies that have garnered international acclaim.

Conclusion:

Pei-Haw Tsao's relentless pursuit of innovation and his passion for creating cutting-edge solutions have solidified his reputation as a visionary inventor in the tech industry. His contributions continue to inspire the next generation of inventors to push the limits of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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