The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Sep. 08, 2011
Wen-yi Lin, Taipei, TW;
Yu-chih Liu, Taipei, TW;
Ming-chih Yew, Hsinchu, TW;
Tsung-shu Lin, Yonghe, TW;
Bor-rung Su, New Taipei, TW;
Jing Ruei LU, Taipei, TW;
Wei-ting Lin, Taipei, TW;
Wen-Yi Lin, Taipei, TW;
Yu-Chih Liu, Taipei, TW;
Ming-Chih Yew, Hsinchu, TW;
Tsung-Shu Lin, Yonghe, TW;
Bor-Rung Su, New Taipei, TW;
Jing Ruei Lu, Taipei, TW;
Wei-Ting Lin, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.