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Taipei, Taiwan

Yu-Chih Liu

This inventor holds 37 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., National Yang Ming Chiao Tung University, Ulead Systems, Inc.. Active years: 2008-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Chih Liu. Retrieved from https://idiyas.com/inventor/yu-chih-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 37 

% Patents Active = 70.3

Average Co-Inventor Count = 4.6

ph-index = 6

Forward Citations = 115(Granted Patents)


Company Filing History:

goldMedal35 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 1,249 
 
National Yang Ming Chiao Tung University
 patents
bronzeMedal1 out of 25 
 
Ulead Systems, Inc.
 patents

Years Active: 2008-2024

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Areas of Expertise:
Semiconductor Packaging
Package-on-Package
Warpage Control
Lid Attachment
Thermal Management
Chip Packaging
Encapsulant Ring
Flip Chip
Die Assembly
Manufacturing Process
Bonding Techniques
Reliability Improvement
37 patents (USPTO):Explore Patents
1. 11972956 - Lid attach process and dispenser head (2024-04-30),
2. 11417643 - Package-on-package with redistribution structure (2022-08-16),
3. 11133285 - Package-on-package structure having polymer-based material for warpage control (2021-09-28),
4. 10879140 - System and method for bonding package lid (2020-12-29),
5. 10867835 - Semiconductor packaging structure and process (2020-12-15),
6. 10685853 - Lid attach processes for semiconductor packages (2020-06-16),
7. 10515941 - Methods of forming package-on-package structures (2019-12-24),
8. 10269763 - Package-on-package structure having polymer-based material for warpage control (2019-04-23),
9. 10269668 - System and method for bonding package lid (2019-04-23),
10. 10163754 - Lid design for heat dissipation enhancement of die package (2018-12-25),
11. 10157863 - Method for forming a lid structure for a semiconductor device package (2018-12-18),
12. 10157772 - Semiconductor packaging structure and process (2018-12-18),
13. 9893043 - Method of manufacturing a chip package (2018-02-13),
14. 9887144 - Ring structure for chip packaging (2018-02-06),
15. 9859265 - Package structure and methods of forming the same (2018-01-02),

Title: The Innovative Journey of Inventor Yu-Chih Liu

Introduction: Yu-Chih Liu, a talented inventor hailing from Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Yu-Chih Liu holds several patents in the areas of electronics and telecommunications, showcasing his expertise and creativity in developing cutting-edge solutions for modern challenges.

Career Highlights: Throughout his career, Yu-Chih Liu has demonstrated a keen ability to transform ideas into tangible inventions that have the potential to revolutionize industries. His dedication to innovation has earned him recognition as a pioneer in his field.

Collaborations: Yu-Chih Liu has collaborated with leading tech companies and research institutions to further his inventions and bring them to market. His partnerships have been instrumental in advancing his work and reaching a wider audience.

Conclusion: In conclusion, Yu-Chih Liu's passion for innovation and his relentless pursuit of excellence have solidified his position as a respected inventor in the global technology landscape. His contributions continue to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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