The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Nov. 02, 2016
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chin-Liang Chen, Hsinchu, TW;
Wei-Ting Lin, Taipei, TW;
Yu-Chih Liu, Taipei, TW;
Kuan-Lin Ho, Hsinchu, TW;
Jason Shen, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 24/27 (2013.01); H01L 24/743 (2013.01); H01L 24/75 (2013.01); H01L 21/565 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/75611 (2013.01); H01L 2924/16152 (2013.01);
Abstract
A lid attach process includes providing a substrate and a die attached to the substrate, providing a lid and dipping a periphery of the lid in a dipping tank of adhesive material such that the adhesive material attaches to the periphery of the lid, and positioning the lid over the die and placing the lid on a top of the substrate with the adhesive material being adapted to interface with a periphery of the substrate.