For the Inventor, By the Inventor

Enter inventor name

Kaohsiung, Taiwan

Chin-Liang Chen

USPTO Granted Patents = 56 (Patent Applications = 2)

Average Co-Inventor Count = 4.8

ph-index = 5

Forward Citations = 95(Granted Patents)

Forward Citations (Not Self Cited) = 88(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hsinchu, TW (2014 - 2024)
Kaohsiung, TW (2015 - 2024)

Company Filing History:

55 out of 40,850

Taiwan Semiconductor Manufacturing Comp. Ltd.

Henghao Technology Co. Limited

Years Active: 2014-2025

Loading Chart...

Areas of Expertise:

Semiconductor Structure

Circuit Structure

Package Structure

Die Corner Removal

Underfill Crack Suppression

Integrated Fan-Out Package

Bonding Package Lid

Heat Dissipation Enhancement

Packaging Methods

Encapsulant Ring

Manufacturing Method

Semiconductor Device

56 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12417969 - Semiconductor structure and circuit structure (2025-09-16),

2. 12417968 - Package structure and forming method thereof (2025-09-16),

3. 12412846 - Semiconductor package and methods of fabricating a semiconductor package (2025-09-09),

4. 12347802 - Die corner removal for underfill crack suppression in semiconductor die packaging (2025-07-01),

5. 12165946 - Semiconductor package and manufacturing method thereof (2024-12-10),

6. 12062619 - Semiconductor packages and forming methods thereof (2024-08-13),

7. 12062604 - Semiconductor structure and manufacturing method thereof (2024-08-13),

8. 11972956 - Lid attach process and dispenser head (2024-04-30),

9. 11908835 - Semiconductor structure and manufacturing method thereof (2024-02-20),

10. 11824032 - Die corner removal for underfill crack suppression in semiconductor die packaging (2023-11-21),

11. 11810847 - Package structure and method of fabricating the same (2023-11-07),

12. 11784106 - Semiconductor package and manufacturing method thereof (2023-10-10),

13. 11749594 - Semiconductor structure and manufacturing method thereof (2023-09-05),

14. 11616037 - Integrated fan-out package and manufacturing method thereof (2023-03-28),

15. 11594479 - Semiconductor structure and manufacturing method thereof (2023-02-28),

Title: Inventor Chin-Liang Chen: Revolutionizing Technology in Kaohsiung

Introduction: Chin-Liang Chen is a pioneering inventor based in Kaohsiung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chen's latest patents focus on advancements in renewable energy technologies, artificial intelligence systems, and sustainable manufacturing processes, showcasing his commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Chin-Liang Chen has established himself as a leading figure in the tech industry, with numerous successful inventions that have significantly impacted various sectors.

Collaborations: Throughout his career, Chen has collaborated with top research institutions, leading companies, and innovative startups to bring his inventions to life, fostering a culture of innovation and collaboration in the industry.

Conclusion: Chin-Liang Chen's relentless pursuit of innovation and his passion for creating cutting-edge technologies continue to inspire the next generation of inventors and shape the future of technology in Kaohsiung and beyond.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…