Jason Shen is a prominent inventor based in Jhubei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His innovative work has helped advance the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Among his latest patents is a lid attach process and dispenser head. This process involves dipping the periphery of a lid in an adhesive material, allowing it to attach securely. The method includes positioning the lid over a die attached to a substrate using a lid carrier, ensuring proper alignment. The adhesive material forms an interface with the substrate, and a thermal interface material (TIM) is contacted on the die with the lid. Another notable patent is a semiconductor apparatus with an inner wafer carrier buffer. This apparatus is designed to receive a wafer carrier and perform a nitrogen purge, enhancing the semiconductor processing capabilities.

Career Highlights

Jason Shen is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to develop and refine his innovative ideas, contributing to the advancement of semiconductor technologies.

Collaborations

Jason has collaborated with notable coworkers, including Chin-Liang Chen and Wei-Ting Lin. Their combined expertise has fostered a productive environment for innovation and development in semiconductor processes.

Conclusion

Jason Shen's contributions to semiconductor technology through his patents and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a key innovator in the field. His ongoing efforts continue to shape the future of semiconductor manufacturing.

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